As shown in FIG. 3 and FIG. 5, the conductive member 50E has a main portion 51E that is a thick portion in the Z direction and an extension portion 52E that is a portion thinner than the main portion 51E. The main portion 51E has the substantially planar shape having the substantially constant thickness. The main portion 51E has a mounting surface 53E adjacent to the semiconductor chip 40 in the Z direction and a heat radiation surface 54E opposite to the mounting surface 53C in the Z direction. The extension portion 52E extends from the end of the main portion 51E in the Y direction. The extension portion 52E extends in the Y direction with the same length in the X direction, that is, the same width as the main portion 51E. A surface of the extension portion 52E adjacent to the semiconductor chip 40 is substantially flush with the mounting surface 53E of the main portion 51E. An opposite surface of the extension portion 52E farther from the semiconductor chip 40 is sealed by the sealing resin body 30. The extension portion 52E may be provided at, at least, an end of the conductive member 50E, at which the main terminals 70 are provided. In the present example, the conductive member 50E has the extension portions 52E at both ends of the main portion 51E. In the present example, the conductive members 50C and 50E are provided by common parts.
