The mounting surface 53E of the main portion 51E of the conductive member 50E is electrically connected to the emitter electrode 42 of the semiconductor chip 40 via a solder 92. Specifically, the conductive member 50E and the terminal member 60 are connected via the solder 92. The emitter electrode 42 and the conductive member 50E are electrically connected via the solder 91, the terminal member 60, and the solder 92. Most part of the conductive member 50E is covered with the sealing resin body 30. The heat radiation surface 54E of the conductive member 50E is exposed from the sealing resin body 30. The heat radiation surface 54E is substantially flush with the rear surface 32. Of the surfaces of the conductive member 50E, areas other than a connection portion with the solder 92, the heat radiation surface 54E, portions to which the main terminals 70 are connected are covered with the sealing resin body 30.
The main terminals 70 are terminals through which the main current flows, among external connection terminals for electrically connecting the semiconductor device 20 and an external device. The semiconductor device 20 includes the multiple main terminals 70. The main terminals 70 connect to the corresponding conductive member 50. The main terminals 70 may be formed integrally with the corresponding conductive member 50 by processing one metal member.