Rotary electric machine unit having rotary electric machine with cooling part and electric power conversion device
摘要
說明書
In the semiconductor device 20 configured as described above, the sealing resin body 30 integrally seals the semiconductor chip 40, a part of each of the conductive members 50, the terminal member 60, a part of each of the main terminals 70, and a part of each of the signal terminals 80. That is, the sealing resin body 30 seals the elements constituting one arm. Therefore, the semiconductor device 20 is also referred to as 1-in-1 package.
The heat radiation surface 54C of the conductive member 50C is substantially flush with the one surface 31 of the sealing resin body 30. The heat radiation surface 54E of the conductive member 50E is substantially flush with the rear surface 32 of the sealing resin body 30. The semiconductor device 20 has a double-sided heat radiation structure in which the heat radiation surfaces 54C and 54E are both exposed from the sealing resin body 30. The semiconductor device 20 having such a structure can be formed, for example, by cutting the conductive members 50 together with the sealing resin body 30. Alternatively, the semiconductor device 20 can be formed by molding the sealing resin body 30 in a state where the heat radiation surfaces 54C and 54E contact with a cavity wall surface of a mold for molding the sealing resin body 30.
Next, the main terminals 70 will be described in detail.
