It may be possible to further have a connecting portion, as a part of the lead frame, integrally provided with at least one of the main terminals 70C and the main terminals 70E to connect the at least same one of the main terminals 70C and the main terminals 70E to each other through the connecting portion. In another example shown in FIG. 16, the semiconductor device 20 includes five main terminals 70, specifically, two main terminals 70C and three main terminals 70E. The lead frame 100 described above has a connecting portion 96 connecting between the main terminals 70E. The main terminals 70E have the longer projection length than the main terminals 70C from the sealing resin body 30, and the connecting portion 96 connects the projection tip end portions of the main terminals 70E. The connecting portion 96 is extended in the X direction, and is spaced apart from the main terminals 70C in the Y direction. The connecting portion 96 is located at the same position as the projecting portions of the main terminals 70C and 70E in the Z direction.
