Rotary electric machine unit having rotary electric machine with cooling part and electric power conversion device
摘要
說明書
The semiconductor devices 20U and 20L are aligned in the X direction, and a predetermined gap is provided between the semiconductor devices 20U and 20L. That is, the semiconductor devices 20U and 20L are aligned in a direction orthogonal to the plate thickness direction of the semiconductor chip 40, that is, the Z direction. The semiconductor devices 20U and 20L are aligned such that the respective one surfaces 31 of the sealing resin bodies 30 are on the same side and the respective rear surfaces 32 are on the same side in the Z direction. Between the semiconductor devices 20U and 20L, the one surfaces 31 are substantially flush with each other in the Z direction, and the rear surfaces 32 are substantially flush with each other in the Z direction.
In each of the semiconductor devices 20U and 20L, the projected portions of signal terminals 80 projecting from the sealing resin body 30 each have substantially an L shape. The projected portion of each signal terminal 80 has one bend portion of approximately 90 degrees. In the projected portion of the signal terminal 80, a portion from the base of the sealing resin body 30 to the bent portion extends in the Y direction, and a portion from the bent portion to the projecting tip end extends in the Z direction and toward a side opposite to the capacitor C1.
