The cooling unit 120 mainly cools the semiconductor devices 20. The cooling unit 120 is formed of a material having excellent thermal conductivity, for example, an aluminum-based material. The cooling unit 120 includes a supply pipe 121, a discharge pipe 122, and a heat exchange part 123. Because the cooling unit 120 is provided in the power module 110, the cooling unit 120 is also referred to as an in-module cooling unit.
The heat exchange part 123 is made of a pair of plates 124 and 125. The plates 124 and 125 are each made by using a thin metal plate having substantially a rectangular planar shape. At least one of the plate 124 and the plate 125 has a bulged-shape, such as a shallow pot-like bottomed shape, as being pressed from the plate shape. In the present example, the plate 124 has the pot-like bottomed shape. Outer peripheral portions of the plates 124 and 125 are fixed to each other, such as by swage, and are entirely joined to each other such as by brazing, so that a flow path 126 is formed between the plate 124 and the plate 125.