The capacitor C1 is arranged so that the heat exchange part 123 is interposed between the capacitor C1 and the semiconductor devices 20. The capacitor C1 is arranged on the opposite side to the semiconductor device 20 with respect to the heat exchange part 123. In the present example, the capacitor C1 is arranged on the opposite side to the semiconductor device 20 with respect to the heat exchange part 123 of the first stage. That is, the capacitor C1 is located adjacent to the open ends of the supply pipe 121 and the discharge pipe 122 than the closed ends of the supply pipe 121 and the discharge pipe 122. The capacitor C1 is located at a position closer to the semiconductor device 20 than the open ends of the supply pipe 121 and the discharge pipe 122 in the Z direction. The capacitor C1 has a positive electrode terminal (not shown) for external connection on a surface facing the heat exchange part 123 in the Z direction, and a negative electrode terminal (not shown) for external connection on a surface opposite to the surface on which the positive electrode terminal is arranged.
The P bus bar 130, the N bus bar 140, and the output bus bar 150 are metal plate members each including a metal having excellent conductivity such as copper, for example. In the present example, the thickness of each bus bar is almost uniform. The P bus bar 130, the N bus bar 140, and the output bus bar 150 have substantially the same thickness. As the metal plate member, a plate of which thicknesses is partially different can be used. The P bus bar 130, the N bus bar 140, and the output bus bar 150 are electrically separated from the cooling unit 120.