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Rotary electric machine unit having rotary electric machine with cooling part and electric power conversion device

專利號(hào)
US11888376B2
公開日期
2024-01-30
申請人
DENSO CORPORATION(JP Kariya)
發(fā)明人
Ryota Tanabe; Yuta Hashimoto; Tomohisa Sano; Tomoyuki Shinkai
IPC分類
H02K5/20; H02K11/33; H02K5/22
技術(shù)領(lǐng)域
terminals,70e,main,in,70c,capacitor,power,direction,housing,cooling
地域: Kariya

摘要

A rotary electric machine unit including a rotary electric machine, and an electric power conversion device having a plurality of power modules. The rotary electric machine includes a stator, a rotor, and a housing. The housing includes a housing flow path through which a refrigerant flows. The power modules of the electric power conversion device and the rotary electric machine are configured to be cooled by the refrigerant.

說明書

The protective member 180 has one surface 181 and a rear surface 182 opposite to the one surface 181 in the Z direction. The one surface 181 and the rear surface 182 are plane surface orthogonal to the Z direction. The protective member 180 of the present example has a substantially truncated quadrangular pyramid shape. Therefore, the protective member 180 has four lateral surfaces 183 to 186. When the one surface 181 is defined as a reference surface, each of the lateral surfaces 183 to 186 is an inclined surface defining an acute angle with respect to the one surface 181.

Components of the power module 110 are arranged, in a direction from the one surface 181 toward the rear surface 182, in a stated order of the connection portion 141 of the N bus bar 140, the capacitor C1, the connection portion 131 of the P bus bar 130, the heat exchange part 123 of the first stage, the semiconductor device 20, the heat exchange part 123 of the second stage, and the drive substrate 160. The supply pipe 121 and the discharge pipe 122 project from the one surface 181 to the outside of the protective member 180. Nothing projects from the rear surface 182. Although not shown, the components may be arranged, in a direction from the one surface 181 toward the rear surface 182, in an order of the drive substrate 160, the heat exchange part 123 of the first stage, the semiconductor device 20, the heat exchange part 123 of the second stage, the connection portion 141 of the N bus bar 140, the capacitor C1, and the connection portion 131 of the P bus bar 130.

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