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Thermal interface sandwich

專利號
US11889662B1
公開日期
2024-01-30
申請人
Lunar Energy, Inc.（US CA Mountain View）
發(fā)明人
Bozhi Yang; Charles Ingalz
IPC分類
H05K7/20
技術(shù)領(lǐng)域
gantry,sink,heat,board,thermally,thermal,circuit,sandwich,cover,conductive
地域： CA CA Mountain View

摘要

A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.

說明書

BACKGROUND OF THE INVENTION

Electrical devices include components that generate considerable heat. However, too much heat could create safety concerns as well as degrade the performance of certain components within the electronic device. It would be desirable to manage the heat generated by certain electrical components within an electrical device while maintaining electrical insulation to prevent any unwanted current flow. Furthermore, it would be desirable to provide an enclosed environment for sensitive electrical components in an electrical device so as to keep out foreign contaminants/pollutants.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings.

FIG. 1 is a diagram showing an embodiment of an inverter device with one side open.

FIG. 2 is a diagram showing an example of a sealed power module.

FIG. 3 is a diagram showing an example of an uncovered power module.

FIG. 4 is a diagram showing example blind mate connector pins that can be used to couple a power board to a terminal board, one on top of the other.

FIG. 5 is a diagram showing an example of a cover to a power module.

FIG. 6 is a diagram showing a closeup image of a gasket that is disposed in a cover to a power module.

權(quán)利要求

1
What is claimed is:1. A thermally conductive assembly, comprising:a thermally conductive solid with a first surface and a second surface;a first thermal interface that is applied to the first surface of the thermally conductive solid; anda second thermal interface that is applied to the second surface of the thermally conductive solid;wherein the thermally conductive solid and the second thermal interface are surrounded by a cavity in a heat sink;wherein a set of heat generating components are pinned against the first thermal interface by a gantry assembly, wherein the gantry assembly is fastened into the heat sink, wherein the gantry assembly extends over the set of heat generating components, and wherein the gantry assembly pushes a pin against a top surface of a respective heat generating component such that a bottom surface of the respective heat generating component is pushed against the first thermal interface.2. The thermally conductive assembly of claim 1, wherein the first thermal interface is adhered to the first surface of the thermally conductive solid.3. The thermally conductive assembly of claim 1, wherein the first thermal interface is silk screened to the first surface of the thermally conductive solid.4. The thermally conductive assembly of claim 1, wherein the first thermal interface is a thermal paste.5. The thermally conductive assembly of claim 1, wherein the first thermal interface is a phase-change material.6. The thermally conductive assembly of claim 1, wherein the thermally conductive solid comprises aluminum nitride.7. The thermally conductive assembly of claim 1, wherein the thermally conductive solid comprises diamond.8. The thermally conductive assembly of claim 1, wherein the thermally conductive solid comprises aluminum beryllium oxide.9. The thermally conductive assembly of claim 1, wherein the second thermal interface is configured to be in direct contact with the heat sink.10. The thermally conductive assembly of claim 9, wherein the heat sink is made of metal.11. The thermally conductive assembly of claim 1, wherein the first thermal interface is configured to be in contact with the bottom surface of the respective heat generating component.12. The thermally conductive assembly of claim 10, wherein the metal is aluminum.
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