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Thermal interface sandwich

專利號(hào)
US11889662B1
公開日期
2024-01-30
申請(qǐng)人
Lunar Energy, Inc.(US CA Mountain View)
發(fā)明人
Bozhi Yang; Charles Ingalz
IPC分類
H05K7/20
技術(shù)領(lǐng)域
gantry,sink,heat,board,thermally,thermal,circuit,sandwich,cover,conductive
地域: CA CA Mountain View

摘要

A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.

說明書

FIG. 2 is a diagram showing an example of a sealed power module. In some embodiments, sealed power module 102 of inverter device 100 of FIG. 1 can be implemented using the example sealed power module that is shown in FIG. 2. The sealed power module includes cover 202 that is configured to join with heat sink 204, which is located below cover 202 as shown in FIG. 2. In various embodiments, heat sink 204 is made of metal (e.g., aluminum). As will be described in further detail below, in some embodiments, cover 202 is joined to heat sink 204 by fasteners that extend from the edges of cover 202 and that engage into receiving holes of the edges of heat sink 204. Furthermore, cover 202 provides a secure seal of the enclosed and covered electrical components due to gaskets (e.g., made of elastomer material) (not shown in FIG. 2) that are placed along the edges of cover 202, which comes into contact with the edges of heat sink 204, when cover 202 is joined with heat sink 204. As mentioned above, heat sink 204 is coupled to one or more circuit boards that are covered by cover 202. As shown in FIG. 2, cover 202 includes one or more cutout regions (e.g., 208a and 208b) that allow the exposure of corresponding regions of an otherwise covered circuit board. As will be described in further detail below, regions of the otherwise covered circuit board that are exposed by the cutout region(s) of cover 202 may include components (e.g., connectors) that are configured to connect to other components within or external to the internal environment of the inverter box. While not shown in FIG. 2, each cutout region of cover 202 is encircled with a gasket that is in contact with the circuit board for which a corresponding region is to be exposed to the exterior of cover 202. By disposing gaskets on regions of cover 202 that are in contact with either heat sink 204 or a covered circuit board, other than the regions of the circuit board that are intentionally exposed via the cutout regions of cover 202, all other components of the enclosed circuit boards are maintained in a securely sealed environment.

權(quán)利要求

1
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