FIG. 7 is a diagram showing a closeup image of an engagement feature that extends out of a cover to a power module.

FIG. 8 is a diagram showing an example of a cover to a power module that is fastened to a terminal circuit board.

FIG. 9 is a diagram showing an example of the external surface of a cover to a power module and in which the cover selectively exposes regions of the terminal circuit board with which it is fastened on its internal surface.

FIG. 10 is a diagram showing an example of a power circuit board that is coupled to a heat sink.

FIG. 11 is a diagram showing a closeup image of a gantry that secures transistors against a thermally conductive and electrically insulating material that is in direct contact (sitting in a cavity of) with a heat sink.

FIG. 12 is a diagram showing an example of a thermally conductive and electrically insulating material that sits between transistors of a power circuit board and a heat sink.

FIG. 13 is a diagram showing an example thermally conductive and electrically insulating material.

FIG. 14 is an example of a thermally conductive and electrically insulating material.

FIG. 15 is a diagram showing an example cavity in a heat sink to place a thermal interface sandwich.

FIG. 16 is a diagram of a closeup image of a gantry.