The first insulating medium layer 201 is formed on the semiconductor substrate 100, and the ferroelectric thin film layer 300 can be disposed on the first insulating medium layer 201. The bottom electrode 400 is formed on the ferroelectric thin film layer 300, and the tunnel junction 500 is formed on the bottom electrode 400. The second insulating medium layer 202 is also formed on the ferroelectric thin film layer 300. The first metal interconnection portion 601 is connected to a first end of the bottom electrode 400, and the second metal interconnection portion 602 is connected to the ferroelectric thin film layer 300. The third metal interconnection portion 603 is connected to a second end of the bottom electrode 400. The second end of the bottom electrode 400 and the first end of the bottom electrode 400 are respectively located on both sides of the bottom electrode 400, and the first end and the second end may each be located on left and right sides of an upper part of the bottom electrode 400. The fourth metal interconnection portion 604 is connected to the tunnel junction 500.