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Voltage control of SOT-MRAM for deterministic writing

專利號
US11930720B2
公開日期
2024-03-12
申請人
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES(CN Beijing)
發(fā)明人
Meiyin Yang; Jun Luo; Yan Cui; Jing Xu
IPC分類
G11C11/16; G11C11/18; G11C11/22; H10B61/00; H10N52/00; H10N52/80
技術(shù)領(lǐng)域
metal,layer,electrode,magnetic,tunnel,portion,disclosure,random,film,junction
地域: Beijing

摘要

The present disclosure provides a storage unit, a data writing method and a data reading method thereof, a memory and an electronic device. The storage unit includes a semiconductor substrate, a first insulating medium layer, a ferroelectric thin film layer, a bottom electrode, a tunnel junction, a first metal interconnection portion, a second metal interconnection portion, a third metal interconnection portion and a fourth metal interconnection portion. The first insulating medium layer is formed on the semiconductor substrate, the ferroelectric thin film layer is disposed on the first insulating medium layer, the bottom electrode is formed on the ferroelectric thin film layer, and the tunnel junction is formed on the bottom electrode. The first metal interconnection portion is connected to a first end of the bottom electrode, and the third metal interconnection portion is connected to a second end of the bottom electrode. The second metal interconnection portion is connected to the ferroelectric thin film layer, and the fourth metal interconnection portion is connected to the tunnel junction. As compared with the prior art, the present disclosure can control a directional flipping of the magnetic moment in the tunnel junction based on the ferroelectric thin film layer provided. Based on the structural design of the storage unit, the present disclosure does not require an external magnetic field, and fully meets the requirement of high integration of the device.

說明書

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The first insulating medium layer 201 is formed on the semiconductor substrate 100, and the ferroelectric thin film layer 300 can be disposed on the first insulating medium layer 201. The bottom electrode 400 is formed on the ferroelectric thin film layer 300, and the tunnel junction 500 is formed on the bottom electrode 400. The second insulating medium layer 202 is also formed on the ferroelectric thin film layer 300. The first metal interconnection portion 601 is connected to a first end of the bottom electrode 400, and the second metal interconnection portion 602 is connected to the ferroelectric thin film layer 300. The third metal interconnection portion 603 is connected to a second end of the bottom electrode 400. The second end of the bottom electrode 400 and the first end of the bottom electrode 400 are respectively located on both sides of the bottom electrode 400, and the first end and the second end may each be located on left and right sides of an upper part of the bottom electrode 400. The fourth metal interconnection portion 604 is connected to the tunnel junction 500.

權(quán)利要求

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