The ferroelectric thin film layer 300 can be, for example, PZT (plumbum zirconate titanate) or HrZrO. The present disclosure can be implemented in CMOS (complementary metal oxide semiconductor) process by thin film growing means such as PVD (physical vapor deposition), ALD (atomic layer deposition), etc. The ferroelectric thin film layer 300 may for example have a square shape or other shapes. The structure of the SOT tunnel junction can be grown on the ferroelectric thin film when processing the device of the present disclosure. In addition, the tunnel junction 500 can specifically include a fixed magnetic layer, a tunnel insulating layer, a free magnetic layer, an upper electrode layer, etc., which are stacked in sequence in a longitudinal direction, and a detail description thereof will be omitted in the present disclosure.