Superconducting quantum computing circuit package
地域：
Oxford
摘要
A superconducting quantum computing circuit package (1). The package contains a substrate (2) on which a circuit is formed, the circuit including a plurality of circuit elements. The substrate (2) includes holes (8) arranged between the circuit elements which extend through a thickness of the substrate (2). The package also contains a holder (3) with a surface (9) on which the substrate (2) is received, and a cover (4) arranged on an opposite side of the substrate (2). The holder (3) and the cover (4) are formed from a metal and/or a superconductor. The holder (3) also contains projections (12) arranged on and projecting from the surface (9). The projections (12) protrude through the holes (8) in the substrate (2) and contact the cover (4) so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit.
說明書
This application is the National Stage of International Application No. PCT/GB2019/052271, filed Aug. 13, 2019, which claims priority to GB 1813188.8, filed Aug. 13, 2018, which are entirely incorporated herein by reference.
This invention relates to a superconducting quantum computing circuit package, in particular to a superconducting quantum computing circuit package including a holder for a substrate of the superconducting quantum computing circuit.
In a quantum computing architecture it is desired to build circuit chips containing multiple qubits such that useful computation may be performed. However, scaling the chips increases the physical space occupied by the chip to a size that supports electromagnetic (EM) modes having frequencies comparable with the operating frequencies of the quantum computing circuit on the chip. For example, a rectangular chip enclosed in conducting material, and having side lengths greater than a few millimetres (and both greater than the thickness) and a high dielectric permittivity of around 10 can support EM modes in the range of several to several tens of gigahertz.
Such electromagnetic “chip-like” modes are almost always unwanted, particularly in the frequency range of several to several tens of gigahertz. These frequencies are similar to the desired operational frequencies of quantum computing circuits and thus they can interfere with the operation of a quantum computing circuit, through interactions with “circuit-like” modes, e.g. qubit modes, other circuit elements and control signals that are used. This can result in the loss of coherence in the circuit, which is important to maintain in order to prolong the operational lifetime of the circuit such that effective quantum processing can be performed.
權(quán)利要求
The invention claimed is:1. A superconducting quantum computing circuit package comprising:a substrate on which a superconducting quantum computing circuit is formed, wherein the superconducting quantum computing circuit comprises a plurality of circuit elements and the substrate comprises one or more holes arranged between the plurality of circuit elements, wherein the one or more holes extend through a thickness of the substrate; and a holder comprising a surface on which the substrate is received and a cover arranged on an opposite side of the substrate from the holder, wherein the holder and the cover are formed from a metal and/or a superconductor and the holder comprises one or more projections arranged on and projecting from the surface; wherein the one or more projections protrude through the one or more holes in the substrate and contact the cover so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit; and wherein the holder comprises one or more apertures formed through the surface of the holder, wherein the superconducting quantum computing circuit package comprises one or more wires arranged to pass through the one or more apertures respectively to connect to the quantum computing circuit. 2. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the plurality of circuit elements comprises one or more of: one or more qubits, one or more control lines and one or more readout elements. 3. The superconducting quantum computing circuit package as claimed in claim 2 , wherein the maximum spacing between adjacent holes in the substrate and/or between adjacent projections on the holder corresponds to a chip-like mode having a frequency greater than the maximum operational frequency of the quantum computing circuit. 4. The superconducting quantum computing circuit package as claimed in claim 2 , wherein the plurality of circuit elements comprises two or more qubits, and wherein the one or more holes are arranged between the two or more qubits, such that the one or more projections are arranged to pass between adjacent qubits. 5. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the surface for receiving the substrate is recessed from a face of the holder. 6. The superconducting quantum computing circuit package as claimed in claim 5 , wherein the surface is recessed from the face of the holder by a depth substantially equal to the thickness of the substrate and/or to the height of the one or more projections. 7. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the one or more holes correspond in shape and size to the one or more projections, such that the one or more holes receive the corresponding one or more projections when the substrate is on the holder. 8. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the one or more projections have a height that is greater than or equal to half the thickness of the substrate. 9. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the one or more projections that protrude into the one or more holes in the substrate are arranged to suppress electromagnetic modes having a frequency of less than 12 GHz. 10. A superconducting quantum computing circuit package comprising:a substrate on which a superconducting quantum computing circuit is formed, wherein the superconducting quantum computing circuit comprises a plurality of circuit elements and the substrate comprises one or more holes arranged between the plurality of circuit elements, wherein the one or more holes extend through a thickness of the substrate; and a holder comprising a surface on which the substrate is received and a cover arranged on an opposite side of the substrate from the holder, wherein the holder and the cover are formed from a metal and/or a superconductor and the holder comprises one or more projections arranged on and projecting from the surface; wherein the one or more projections protrude through the one or more holes in the substrate and contact the cover so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit; and wherein the cover comprises one or more apertures formed through the cover, wherein the quantum computing circuit package comprises one or more wires arranged to pass through the one or more apertures respectively to connect to the quantum computing circuit. 11. The superconducting quantum computing circuit package as claimed in claim 1 , wherein cover is spaced from the plurality of circuit elements on the substrate. 12. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the cover comprises cut-outs in its surface corresponding to, and facing, the plurality of circuit elements on the substrate. 13. The superconducting quantum computing circuit package as claimed in claim 1 , wherein the holder and the cover have been subject to a surface treatment. 14. A superconducting quantum computing circuit package comprising:a substrate on which a superconducting quantum computing circuit is formed, wherein the superconducting quantum computing circuit comprises a plurality of circuit elements and the substrate comprises one or more holes arranged between the plurality of circuit elements, wherein the one or more holes extend through a thickness of the substrate; and a holder comprising a surface on which the substrate is received and a cover arranged on an opposite side of the substrate from the holder, wherein the holder and the cover are formed from a metal and/or a superconductor and the holder comprises one or more projections arranged on and projecting from the surface; wherein the one or more projections protrude through the one or more holes in the substrate and contact the cover so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit; wherein the cover comprises one or more depressions corresponding to the one or more projections, wherein the one or more depressions are arranged to receive the one or more projections, such that the one or more projections contact the cover in the corresponding one or more depressions; and wherein the cover comprises a volume of a conducting material in the one or more depressions, wherein the material is softer than the metal of the cover.
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