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Superconducting quantum computing circuit package

專利號
US11937517B2
公開日期
2024-03-19
申請人
Oxford University Innovation Limited(GB)
發(fā)明人
Peter Spring; Peter Leek
IPC分類
G06N10/00; H10N60/12; H10N69/00
技術(shù)領(lǐng)域
quantum,substrate,holder,qubits,circuit,computing,cover,e.g,modes,in
地域: Oxford

摘要

A superconducting quantum computing circuit package (1). The package contains a substrate (2) on which a circuit is formed, the circuit including a plurality of circuit elements. The substrate (2) includes holes (8) arranged between the circuit elements which extend through a thickness of the substrate (2). The package also contains a holder (3) with a surface (9) on which the substrate (2) is received, and a cover (4) arranged on an opposite side of the substrate (2). The holder (3) and the cover (4) are formed from a metal and/or a superconductor. The holder (3) also contains projections (12) arranged on and projecting from the surface (9). The projections (12) protrude through the holes (8) in the substrate (2) and contact the cover (4) so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit.

說明書

However, preferably the one or more projections (of the holder) extend all the way through the thickness of the substrate to contact the cover. Thus preferably the height of the one or more projections is (e.g. each) greater than or equal to the thickness of the substrate. The Applicant has found that when the projections extend all the way through the thickness of the substrate, this may be particularly effective in suppressing (e.g. substantially eliminating) electromagnetic modes in the operational frequency range of the quantum computing circuit.

When the holder comprises a recess or rim, preferably the depth of the recess or height of the rim is substantially equal to the height of the one or more projections. Thus preferably the depth of the recess or height of the rim is between 0.2 mm and 1 mm (e.g. approximately 0.5 mm).

Preferably the one or more projections are (e.g. each) between 0.2 mm and 1 mm (e.g. approximately 0.5 mm) in width (i.e. in the direction parallel to the surface of the holder). Thus preferably the one or more holes are (e.g. each) between 0.2 mm and 1 mm (e.g. approximately 0.5 mm) in width (i.e. in the direction parallel to the face of the substrate).

權(quán)利要求

1
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