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Superconducting quantum computing circuit package

專利號
US11937517B2
公開日期
2024-03-19
申請人
Oxford University Innovation Limited(GB)
發(fā)明人
Peter Spring; Peter Leek
IPC分類
G06N10/00; H10N60/12; H10N69/00
技術領域
quantum,substrate,holder,qubits,circuit,computing,cover,e.g,modes,in
地域: Oxford

摘要

A superconducting quantum computing circuit package (1). The package contains a substrate (2) on which a circuit is formed, the circuit including a plurality of circuit elements. The substrate (2) includes holes (8) arranged between the circuit elements which extend through a thickness of the substrate (2). The package also contains a holder (3) with a surface (9) on which the substrate (2) is received, and a cover (4) arranged on an opposite side of the substrate (2). The holder (3) and the cover (4) are formed from a metal and/or a superconductor. The holder (3) also contains projections (12) arranged on and projecting from the surface (9). The projections (12) protrude through the holes (8) in the substrate (2) and contact the cover (4) so to suppress electromagnetic modes in the frequency range of operation of the quantum computing circuit.

說明書

Scaling quantum computing chips to include multiple qubits increases the physical space occupied by the chip to a size that supports electromagnetic modes having frequencies comparable with the operating frequencies of the quantum computing circuit on the chip. Such spurious EM chip-like modes may interfere with the operation of a quantum computing circuit resulting in a detrimental lack of coherence in the qubits. As will now be described, an embodiment of the present invention provides a superconducting quantum computing circuit package in which these spurious modes, as well as cross-talk, are suppressed.

FIG. 1 shows a superconducting quantum computing circuit package 1 according to an embodiment of the present invention. The package 1 includes a substrate 2, a holder 3 for the substrate 2 and a cover 4. The package 1 is shown in FIG. 1 in an expanded configuration, e.g. prior to assembly.

FIG. 2 shows the substrate 2 of the superconducting quantum computing circuit package 1 shown in FIG. 1. The substrate is typically made from silicon or sapphire. A quantum computing circuit 5 is formed on the surface of the substrate 2 (a similar circuit may also be formed on the opposite face of the substrate 2).

The quantum computing circuit 5 includes multiple qubits 6 arranged in a regular geometric grid. The qubits 6 are connected together by respective interconnections 7. The qubits 6 are addressed by respective control lines and readout elements, e.g. as disclosed in the Applicant's previous application published as WO 2017/021714 A1.

權(quán)利要求

1
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