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MEMS chip

專利號
US11968497B2
公開日期
2024-04-23
申請人
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.（CN Shenzhen）
發(fā)明人
Zhengyu Shi; Linlin Wang; Rui Zhang
IPC分類
H04R19/04; B81B3/00; H04R7/04; H04R7/18
技術(shù)領(lǐng)域
membrane,reinforce,mems,protrusion,chip,fixation,portion,in,back,cavity
地域： Shenzhen

摘要

The present invention discloses a Micro-Electro-Mechanical System MEMS) chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

說明書

1 2 3 4 5 6 7 8
FIELD OF THE PRESENT INVENTION

The present invention relates to micro-electromechanical systems, especially relates to a MEMS chip applied in mobile device.

DESCRIPTION OF RELATED ART

Micro-Electro-Mechanical System (MEMS) chips are widely applied in acoustic components, such as MEMS condenser microphone. In related art, the MEMS chip is sealed in a shell with an accommodation space. The MEMS chip includes a substrate with a back cavity and a capacitance system disposed on the substrate. The capacitance system includes a membrane and a back plate arranged at an interval. A sound hole is provided on the shell communicating the back cavity, thus allowing the membrane to move under external pressure wave.

In related art, when whole edge of the membrane is fixed on the substrate, the internal stress of the membrane results in a tense state, thus improving the stiffness of the membrane. Under this condition, the sensitivity of the MEMS chip would reduce with the increase of the membrane stiffness. When the edge of the membrane is partially fixed on the substrate, a leakage path formed between the substrate and the membrane may reduce the resonance frequency and the low frequency property of the MEMS chip.

Therefore, it is necessary to provide an improved MEMS chip to overcome the problems mentioned above.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a MEMS chip with higher sensitivity, higher resonance frequency and higher low frequency property.

權(quán)利要求

1
What is claimed is:1. A Micro-Electro-Mechanical System (MEMS) chip comprising:a substrate with a back cavity;a capacitance system disposed on the substrate, comprising:a back plate;a membrane in a circle shape opposite to the back plate forming an inner cavity;a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; anda reinforce portion fixed to the membrane, having an area smaller than that of the membrane;a support system configured to support the capacitance system, comprising:a first fixation portion suspending the membrane on the substrate; anda second fixation portion suspending the back plate on the substrate; whereinthe reinforce portion comprises a plurality of reinforce ribs in a strip shape; the reinforce rib extends along a radial direction of the membrane; the reinforce ribs are arranged as a ring around a center of the membrane;the protruding portion comprises a first protrusion located in a central position and a second protrusion surrounding the first protrusion;a projection of the first protrusion along the vibration direction located inside an area enclosed by an inner end of each reinforce rib;a projection of the reinforce portion along the vibration direction is located inside the second protrusion.2. The MEMS chip as described in claim 1, wherein a projection of the reinforce portion along the vibration direction is located in the back cavity.3. The MEMS chip as described in claim 2, wherein the reinforce portion is fixed to one side of the membrane away from the inner cavity.4. The MEMS chip as described in claim 1, wherein along the vibration direction, the first protrusion is located corresponding to the center of the membrane.5. The MEMS chip as described in claim 4, wherein the first protrusion is in a cylinder shape.6. The MEMS chip as described in claim 4, wherein the second protrusion is in an annular shape.7. The MEMS chip as described in claim 4, wherein the protruding portion extends from a side of the back plate facing the membrane towards the membrane.8. The MEMS chip as described in claim 1, wherein the capacitance system further comprises a plurality of elastic arms connecting a periphery of the membrane to the first fixation portion.
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