UE 401 and target RU 412 now wirelessly exchange low-latency data for the low-latency application. Target RU 412 and target DU 414 exchange the low-latency data. Target DU 414 and SDAPF 612 in target CU 416 exchange the low-latency data responsive to the N2 signaling from AMF 422. SDAPF 612 and target UPF 432 exchange the low-latency data responsive to the N2 signaling from AMF 421 and the N4 signaling from SMF 422. Target UPF 432 and ASF 434 exchange the low-latency data responsive to the N4 signaling from SMF 422, ASF 434 serves the low-latency application in UE 401 based on the retrieved UE application context for UE 401.

The wireless data network circuitry described above comprises computer hardware and software that form special-purpose network circuitry to handover wireless UEs that execute low-latency applications. The computer hardware comprises processing circuitry like CPUs, DSPs, GPUs, transceivers, bus circuitry, and memory. To form these computer hardware structures, semiconductors like silicon or germanium are positively and negatively doped to form transistors. The doping comprises ions like boron or phosphorus that are embedded within the semiconductor material. The transistors and other electronic structures like capacitors and resistors are arranged and metallically connected within the semiconductor to form devices like logic circuitry and storage registers. The logic circuitry and storage registers are arranged to form larger structures like control units, logic units, and Random-Access Memory (RAM). In turn, the control units, logic units, and RAM are metallically connected to form CPUs, DSPs, GPUs, transceivers, bus circuitry, and memory.