白丝美女被狂躁免费视频网站,500av导航大全精品,yw.193.cnc爆乳尤物未满,97se亚洲综合色区,аⅴ天堂中文在线网官网

Electrical devices with electrodes on softening polymers and methods of manufacturing thereof

專利號(hào)
US11991836B2
公開日期
2024-05-21
申請(qǐng)人
Board of Regents, The University of Texas System（US TX Austin）
發(fā)明人
Romil Modi; Jonathan Reeder; Gregory T. Ellson; Walter E. Voit; Alexandra Joshi Imre
IPC分類
H05K1/09; H05K1/11; H05K3/00; H05K3/04; H05K3/06; H05K3/12; H05K3/40; H01L21/033; H05K1/03; H05K3/34
技術(shù)領(lǐng)域
softening,layer,polymer,electrode,liftoff,solder,inorganic,hardmask,trace,in
地域： TX TX Austin

摘要

An electrical device, comprising a softening polymer layer, an electrode layer on a surface of the softening polymer layer and a cover polymer layer on the surface of the softening polymer layer. An opening in the polymer cover layer is filled with a reflowed solder, one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer, and another end of the reflowed solder contacts an electrical connector electrode of the device.

說(shuō)明書

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a divisional of U.S. application Ser. No. 16/591,002 filed on Oct. 2, 2019, entitled, ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOF, which is a divisional of U.S. application Ser. No. 15/794,863 filed on Oct. 26, 2017, of the same title, which claims the benefit of U.S. Provisional Application Ser. No. 62/414,532 filed on Oct. 28, 2016, commonly assigned with the present invention and incorporated herein by reference.

TECHNICAL FIELD

This application is directed, in general, to electrical devices, and more specifically, flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices.

BACKGROUND

The ability to form electrical devices with components such as electrode traces and electrode pads, on softening polymers opens the opportunity to fabricate flexible electrical devices. Flexible electrical devices have many possible biomedical applications, e.g., as implantable or non-implanted devices. There is a continuing need to improve the processes to fabricate such devices, such that the devices are more sensitive, less prone to delamination of the electrical components from the polymers, and/or, connectable to recording or stimulating control devices.

SUMMARY

權(quán)利要求

1
What is claimed is:1. An electrical device, comprising:a softening polymer layer;an electrode layer on a surface of the softening polymer layer; anda cover polymer layer on the surface of the softening polymer layer, wherein:an opening in the polymer cover layer is filled with a reflowed solder,one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer,another end of the reflowed solder contacts an electrical connector electrode of the device; andthe cover polymer layer is composed of a second softening polymer on the surface of the softening polymer layer, wherein an opening in the second softening polymer cover layer exposes a portion of a surface of the electrode layer, and wherein the softening polymer layer and the cover layer of the second softening polymer are composed of a softening polymer having a Young's modulus that decreases by more than 1 order of magnitude within a 30° C. temperature increase.2. The electrical device of claim 1, wherein the solder is a lead-free solder having equal to or less than 0.1% lead.3. The electrical device of claim 2, wherein the lead-free solder is composed of an indium silver solder.4. The electrical device of claim 3, wherein the indium silver solder has an indium:silver mole ratio of 97:3.5. The electrical device of claim 3, wherein the indium silver solder has melting point of 143° C.6. The electrical device of claim 3, wherein the indium silver solder further includes one or more of gold, tin or bismuth.7. The electrical device of claim 2, wherein the lead-free solder is composed of a tin, silver, indium alloy.8. The electrical device of claim 2, wherein the lead-free solder includes alloys of indium, silver, gold, tin and bismuth.9. The electrical device of claim 1, wherein the one end of the reflowed solder contacting the contact pad is free of a nickel adhesion and barrier layer.10. The electrical device of claim 1, wherein the other end of the reflowed solder contacting the electrical connector pad is free of a nickel adhesion and barrier layer.11. The electrical device of claim 1, wherein the electrical connector electrode is connected to one of a recording device, stimulating control device, a nano-Omnetics connector, a wireless chip or a metal wire.12. The electrical device of claim 1, wherein a mechanical neutral plane of the device is located at or above the surface of the softening polymer layer.13. The electrical device of claim 1, wherein the cover layer has a Young's modulus that is within ±10 percent of a Young's modulus of the softening polymer layer.14. The electrical device of claim 1, wherein the cover layer has a thickness that is within ±10 percent of a thickness of the softening polymer layer.15. The electrical device of claim 1, wherein the within 30° C. temperature increase is from a lower temperature of 20° C. to a higher temperature of 50° C.16. The electrical device of claim 1, wherein the within 30° C. temperature increase is from a lower temperature of 20° C. to a higher temperature of 37° C.
微信群二維碼
意見(jiàn)反饋