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Three-dimensional memory

專利號
US11991887B2
公開日期
2024-05-21
申請人
Taiwan Semiconductor Manufacturing Company, Ltd.(TW Hsinchu)
發(fā)明人
Chenchen Jacob Wang; Chun-Chieh Lu; Yi-Ching Liu
IPC分類
H10B51/40; G11C11/22; G11C16/08; H01L23/522; H10B43/27; H10B43/40; H10B51/20; H10B43/10; H10B51/10
技術(shù)領域
bit,sub,memory,lv0,line,conductive,bl0_0,in,structure,lines
地域: Hsinchu

摘要

Three-dimensional memories are provided. A three-dimensional memory includes a memory cell array, a first interconnect structure, a bit line decoder and a second interconnect structure. The bit line decoder is formed under the memory cell array and the first interconnect structure. The memory cell array includes a plurality of memory cells formed in a plurality of levels stacked in a first direction. The first interconnect structure includes at least one bit line extending in a second direction that is perpendicular to the first direction. The bit line includes a plurality of sub-bit lines stacked in the first direction. Each of the sub-bit lines is coupled to the memory cells that are arranged in a line in the corresponding level of the memory cell array. The second interconnect structure is configured to connect the bit line to the bit line decoder passing through the first interconnect structure.

說明書

In each of the levels LV0 to LVm, the sub-lines of the lines LN0 to LNx are separated by the sub-bit line or the sub-source line. For example, in the level LV0, the sub-lines LN0_0 and LN1_0 are separated by the sub-source line SL0_0, and the sub-lines LN1_0 and LN2_0 are separated by the sub-bit line BL1_0. Furthermore, in each of the levels LV0 to LVm, the sub-source line is surrounded by the two adjacent sub-lines. Similarly, the sub-bit line is surrounded by the two adjacent sub-lines.

In each of the levels LV0 to LVm, the sub-source line is shared by the memory cells of two adjacent sub-lines, and the sub-bit line is shared by the memory cells of two adjacent sub-lines. For example, in the level LV0, the sub-source line SL0_0 is shared by the memory cells in the sub-lines LN0_0 and LN1_0, and the sub-bit line BL1_0 is shared by the memory cells in the sub-lines LN1_0 and LN2_0.

In the memory cell array of FIG. 2, the lines LN0 to LNx of the memory cells 30 extend in the Y direction. Furthermore, for each of the lines LN0 to LNx, the sub-lines are stacked along a line perpendicular to the plane formed by X direction and Y direction (e.g., Z direction of FIG. 1). For example, the sub-line LN0_0 is the highest line and the sub-line LN0_m is the lowest line in the stacked sub-lines of line LN0.

權(quán)利要求

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