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Semiconductor device and method for manufacturing the same

專利號(hào)
US11991937B2
公開日期
2024-05-21
申請人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.(TW Hsinchu)
發(fā)明人
Hai-Dang Trinh; Hsing-Lien Lin; Fa-Shen Jiang
IPC分類
H10N70/20; H10N70/00
技術(shù)領(lǐng)域
layer,electrode,diffusion,barrier,switching,ions,bottom,in,16s,or
地域: Hsinchu

摘要

A semiconductor device includes a bottom electrode, a top electrode over the bottom electrode, a switching layer between the bottom electrode and the top electrode, wherein the switching layer is configured to store data, a capping layer in contact with the switching layer, wherein the capping layer is configured to extract active metal ions from the switching layer, an ion reservoir region formed in the capping layer, a diffusion barrier layer between the bottom electrode and the switching layer, wherein the diffusion barrier layer includes palladium (Pd), cobalt (Co), or a combination thereof and is configured to obstruct diffusion of the active metal ions between the switching layer and the bottom electrode, and the diffusion layer has a concaved top surface, and a passivation layer covering a portion of the top electrode, and wherein the passivation layer directly contacts a top surface of the switching layer.

說明書

As shown in FIG. 6F, a passivation layer 38 can be optionally formed. In some embodiments, the passivation layer 36 is insulative. In some embodiments, the passivation layer 38 covers the upper surface of the top electrode 22. In some embodiments, the passivation layer 38 covers edges of the top electrode 22, the capping layer 20 and the ion reservoir region 18. In some embodiments, the passivation layer 38 further covers a portion of the switching layer 16. In some embodiments, the material of the passivation layer 38 includes dielectric material such as silicon oxide, silicon nitride, silicon oxynitride or the like, but is not limited thereto.

權(quán)利要求

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