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Semiconductor device and method for manufacturing the same

專利號(hào)
US11991937B2
公開日期
2024-05-21
申請人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.(TW Hsinchu)
發(fā)明人
Hai-Dang Trinh; Hsing-Lien Lin; Fa-Shen Jiang
IPC分類
H10N70/20; H10N70/00
技術(shù)領(lǐng)域
layer,electrode,diffusion,barrier,switching,ions,bottom,in,16s,or
地域: Hsinchu

摘要

A semiconductor device includes a bottom electrode, a top electrode over the bottom electrode, a switching layer between the bottom electrode and the top electrode, wherein the switching layer is configured to store data, a capping layer in contact with the switching layer, wherein the capping layer is configured to extract active metal ions from the switching layer, an ion reservoir region formed in the capping layer, a diffusion barrier layer between the bottom electrode and the switching layer, wherein the diffusion barrier layer includes palladium (Pd), cobalt (Co), or a combination thereof and is configured to obstruct diffusion of the active metal ions between the switching layer and the bottom electrode, and the diffusion layer has a concaved top surface, and a passivation layer covering a portion of the top electrode, and wherein the passivation layer directly contacts a top surface of the switching layer.

說明書

As used herein, the terms such as “first,” “second,” and “third” describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another. The terms such as “first,” “second,” and “third” when used herein do not imply a sequence or order unless clearly indicated by the context.

權(quán)利要求

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