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Method of manufacturing a memory device comprising introducing a dopant into silicon oxide

專利號
US11991939B2
公開日期
2024-05-21
申請人
Kioxia Corporation(JP Tokyo)
發(fā)明人
Yoshinori Kumura
IPC分類
H10N70/00; H10B61/00; H01L29/36
技術(shù)領(lǐng)域
variable,resistance,dopant,material,electrode,in,memory,ibe,32b,conductor
地域: Tokyo

摘要

According to one embodiment, a method of manufacturing a memory device including a silicon oxide and a variable resistance element electrically coupled to the silicon oxide, includes: introducing a dopant into the silicon oxide from a first surface of the silicon oxide by ion implantation; and etching the first surface of the silicon oxide with an ion beam.

說明書

In general, the dopant concentration distribution formed by ion implantation has a normal distribution (or, a Gaussian distribution) that spreads along the ion traveling direction in an ion implantation target. In the example shown in FIG. 5, the dopant concentration distribution has a certain local maximum value in the variable resistance material 32. In FIG. 5, the dopant concentration distribution has a peak in the lower electrode 31. This is because the variable resistance material 32 and the lower electrode 31 are made of different materials. In the description below, for convenience of description, the maximum concentration in the variable resistance material 32 included in the set of variable resistance material 32 and lower electrode 31 will be referred to as a peak concentration. In general, the dopant concentration in an ion implantation target is almost zero in the vicinity of the surface from which the ions enter. The closer to the inside of the ion implantation target from the ion entering surface, the higher will be the dopant concentration. Likewise, the dopant concentration is zero at a position that is away from the ion entering surface of the set of variable resistance material 32 and lower electrode 31 in the depth direction. In the example shown in FIG. 5, the dopant concentration is zero in the bottom surface of the lower electrode 31.

權(quán)利要求

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