Electrochemical energy storage devices
摘要
說(shuō)明書
Optionally, solid electrolytes may be fabricated using a controllable deposition method. Useful deposition techniques include, but are not limited to, atomic layer deposition, magnetron sputtering, spin deposition, thermal evaporation, and chemical vapor deposition. Other fabrication techniques useful for fabricating the electrolytes may include or involve other techniques, such as ultraviolet lithography, x-ray lithography, holographic lithography, laser ablation, and thermal evaporation. The electrolyte may also be patterned using conventional patterning techniques known in the art of microfabrication, including masking, lift-off, etching, etc. to generate a desired electrolyte layout.
Optionally, formation of the solid electrolyte in an amorphous state may occur by carefully controlling the deposition conditions, such as temperature, pressure, precursor selection, and the like. For example, the solid electrolyte may be deposited at a relatively low temperature to maintain formation of an amorphous structure. In embodiments, deposition at temperatures too high may result in formation of a polycrystalline electrolyte structure. Example deposition temperatures for deposition of the solid electrolyte in an amorphous state are at or about 100° C., 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C., 180° C., 190° C., 200° C., 210° C., 220° C., 230° C., 240° C., or 250° C., between 0° C. and 300° C., between 0° C. and 250° C., between 50° C. and 250° C., between 100° C. and 250° C., between 150° C. and 250° C., or between 200° C. and 250° C.
