The production method according to an exemplary embodiment the present invention may further include surface-treating at least one surface of an active material film, after slicing an active material bulk to produce an active material film, before integrating, or after integrating the active material film and the current collector. The surface treatment may include a surface roughness adjustment. Specifically, the surface treatment step may be a treatment of relatively (relative to the surface of the active material film before treatment) decreasing a surface roughness of at least one surface of the active material film, a treatment of relatively increasing a surface roughness at least one surface of the active material film, or a treatment of decreasing a surface roughness of one surface of the active material film and increasing surface roughness of the other surface.
An example of the treatment of relatively decreasing the surface roughness may include surface polishing, and an example of the treatment of relatively increasing the surface roughness may include surface etching, mechanical scratch, and the like. Here, surface etching may include plasma etching, partial oxidation of a surface region when the active material film includes the carbon-based electrode active material, or the like, but the present invention is not limited thereto, and any surface treatment method which is commonly used for increasing or decreasing a surface roughness of an inorganic film or carbon-based film may be used.
After producing the active material film from the active material bulk, a step of integrating the current collector and the active material film (binding step) may be performed. Here, integration may mean a state in which the current collector and the active material film are directly bound, or the current collector and the active material film are adhered to each other.