As an example of the binding step, a metal film is directly formed on the active material film and integrated. By the configuration in which the active material film is a film sliced from the active material bulk, specifically the active material film is a film capable of free-standing, the active material film may serve as a substrate (board). Thus, a metal film is formed on one surface of the active material film, using the active material film as a substrate, thereby integrating the current collector and the active material film. A metal film may be formed by any method which is conventionally commonly used for forming an electrode or a metal film, such as deposition (including chemical and physical deposition) of metal or application and heat treatment of a conductive ink.
As another example of the binding step, the binding step may include c1) forming an adhesive layer on at least one surface of a surface of the current collector and a surface of the active material film; and c2) layering a current collector and an active material film so as to be in contact with each other, with the adhesive layer interposed therebetween.