After an adhesive layer is formed on at least one surface of the surface of the current collector and the surface of the active material film, the current collector and the active material film are layered so as to be in contact with each other with the adhesive layer interposed therebetween, thereby adhering the active material film to the current collector. For uniform adhesion, curing of the adhesive, reinforced binding force, rapid binding, or the like, one or more of heat, light, and pressure may be applied, when the current collector and the active material film are layered. As a substantial example when the current collector and the active material film are layered, heat may be applied, and pressure with heat may be applied. A specific example of applying pressure With heat during adhesion may include hot compression and the like, and a pressure in the hot compression may be applied by pressing by a surface pressure method and a linear pressure method, and the like, but the present invention is not limited thereto.
In the binding step, the active material film may be bound to at least one surface of the current collector, that is, one surface of the current collector or each of the two opposing surfaces of the current collector.
When the active material film is intended be adhered to each of the two surfaces opposing each other of the current collector, the active material film is adhered to one surface of the two surfaces opposing each other of the current collector by steps c1) and c2), and then the active material film is adhered to the other surface of the two opposing surfaces again by steps c1) and c2), and the active material film may be adhered to each of the two surfaces opposing each other of the current collector.