When the adhesive layer includes a resin solution, the adhesive layer is layered so that the current collector and the active material film are in contact with each other with the applied film of the resin solution interposed therebetween, the solvent of the resin solution is removed by volatilization to bind the active material film to the current collector. When the resin solution is used, the resin dissolved in the resin solution may include a binder material (aqueous binder and/or non-aqueous binder) described above as an example of the additive.
As described above, the adhesive layer may include a thermocurable, photocurable, and/or chemical curable resin. Here, when the light transmittance of the current collector or the active material layer is low, it is preferred that the adhesive layer contains the thermocurable resin and/or the chemical curable resin.
The thermocurable resin or chemical curable resin may be any resin known as being cured by heat or chemically, and as an example, may include an epoxy resin, an unsaturated polyester resin, a vinylester resin, an acryl resin, a phenol resin, a urea resin, a melamine resin, an aniline resin, a polyimide resin, a bismaleimide resin, and the like, but is not limited thereto. The curable resin may be used alone or in combination of two or more. When the adhesive layer contains the thermocurable resin or the chemical curable resin, it may further contain a curing agent or a curing accelerating agent which is known as being used in the corresponding resin, of course.
The adhesive layer may be conductive or non-conductive.
When the adhesive layer is non-conductive, the adhesive layer may include a non-conductive resin having curability described above.