When the adhesive layer is conductive, the adhesive layer may include one or more conductive components selected from the group comprising conductive resin, conductive particles, and conductive nanostructures. The conductive component may be mixed in a resin solution or a resin melt and applied with the resin.
As a specific example, when the adhesive layer is conductive, the adhesive layer may include one or more components selected from the group comprising conductive particles and conductive nanostructures, together with the non-conductive resin having curability described above.
As a specific example, when the adhesive layer is conductive, the adhesive layer may include a conductive resin. The conductive resin may have at least curability after removal by volatilization of a solvent (that is, curing by drying), but is not limited thereto, and may have heat or chemical curability by a functional group or have curability by solidification (phase transformation of melting-solidification), of course.
As a specific example, when the adhesive layer is conductive, the adhesive layer may include one or more components selected from the group comprising conductive particles and conductive nanostructures, together with the conductive resin.
That is, the adhesive layer may include a resin matrix, and the resin matrix may be a conductive adhesive layer which is a conductive resin having curability. Otherwise, the adhesive layer may include a resin matrix, and the resin matrix is a non-conductive resin, but the adhesive layer may be a conductive adhesive layer which is dispersed and positioned in the resin matrix and includes one or more dispersed phases selected from conductive particles and conductive nanostructures.