The conductive particles of the adhesive layer may include one or two or more particles selected from the group comprising conductive resin particles, metal particles, core-shell particles of non-conductive core-conductive shell (shell of conductive resin or metal shell), and core-shell particles of conductive core-non-conductive shell, but are not limited thereto.
The conductive nanostructure of the adhesive layer may include metal nanowire such as silver nanowire; conductive nanotubes such as carbon nanotubes; metal nanoplates such as a gold nanoplate or a silver nanoplate; two-dimensional carbon bodies as graphene; metal nanorods such as a silver nanorode; or a mixture thereof, but is not limited thereto.
The conductive resin of the adhesive layer may be polyacetylene, polypyrrole, poly(3,4-ethylenedioxythiophene) (PEDOT:PSS), poly(styrene sulfonate)), polyaniline, poly(3-methylthiophene) (P3MT), mixed resins thereof, and the like, but is not limited thereto.
In addition, the conductive or non-conductive adhesive layer may be common non-conductive films (NCF), anisotropic conductive films (ACF), conductive films (CF), or laminated films thereof, which are used for adhesion in the packaging field such as flip chip connection or chip mounting of the conventional electronic components, or may be applied films of anisotropic conductive paste (ACP), conductive paste, or non-conductive paste (NCP), but is not limited thereto.