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Secondary battery electrode, and method for producing same

專(zhuān)利號(hào)
US11996539B2
公開(kāi)日期
2024-05-28
申請(qǐng)人
SK INNOVATION CO., LTD.(KR Seoul)
發(fā)明人
Jonghyuk Lee; Dockyoung Yoon; Heegyoung Kang
IPC分類(lèi)
H01M4/04; H01M4/131; H01M4/133; H01M4/134; H01M4/1391; H01M4/1393; H01M4/1395; H01M4/36; H01M4/62; H01M4/66; H01M10/0525; H01M4/02
技術(shù)領(lǐng)域
active,electrode,material,film,bulk,battery,may,secondary,in,resin
地域: Seoul

摘要

A method for producing a secondary battery electrode, according to the present invention, comprises: a slicing step for producing an active material film by slicing an active material bulk; and a binding step for combining a current collector and the active material film. A method for producing a secondary battery electrode according to the present invention produces an active material film by slicing an active material bulk, which is a free-standing molded body or pellet, thus allowing binder-free active material film to be produced, and as no actual restrictions exist for the thickness of the active material film, thick active material film can be produced, and thus electrodes having high-loading and high composite density can be produced.

說(shuō)明書(shū)

The conductive particles of the adhesive layer may include one or two or more particles selected from the group comprising conductive resin particles, metal particles, core-shell particles of non-conductive core-conductive shell (shell of conductive resin or metal shell), and core-shell particles of conductive core-non-conductive shell, but are not limited thereto.

The conductive nanostructure of the adhesive layer may include metal nanowire such as silver nanowire; conductive nanotubes such as carbon nanotubes; metal nanoplates such as a gold nanoplate or a silver nanoplate; two-dimensional carbon bodies as graphene; metal nanorods such as a silver nanorode; or a mixture thereof, but is not limited thereto.

The conductive resin of the adhesive layer may be polyacetylene, polypyrrole, poly(3,4-ethylenedioxythiophene) (PEDOT:PSS), poly(styrene sulfonate)), polyaniline, poly(3-methylthiophene) (P3MT), mixed resins thereof, and the like, but is not limited thereto.

In addition, the conductive or non-conductive adhesive layer may be common non-conductive films (NCF), anisotropic conductive films (ACF), conductive films (CF), or laminated films thereof, which are used for adhesion in the packaging field such as flip chip connection or chip mounting of the conventional electronic components, or may be applied films of anisotropic conductive paste (ACP), conductive paste, or non-conductive paste (NCP), but is not limited thereto.

權(quán)利要求

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