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Battery module

專利號
US11996572B2
公開日期
2024-05-28
申請人
SAMSUNG SDI CO., LTD.(KR Yongin-si)
發(fā)明人
Junhyung Lee; Daeyeop Park; Heonhee Kim; Jisoon Lim; Sunghoon Jung
IPC分類
H01M50/209; H01M10/6556; H01M50/186
技術(shù)領(lǐng)域
boundary,portion,plate,p2,sealing,may,p1a,main,p2a,second
地域: Yongin-si

摘要

A battery module includes: one or more cell assemblies; a main housing comprising a main boundary portion surrounding an accommodation space in which the one or more cell assemblies are positioned; a first plate comprising a first boundary portion coupled with the main boundary portion and a first exposure portion exposed from the main boundary portion and defining a side of a cooling fluid passage for cooling the accommodation space; and a second plate facing the first plate and comprising a second boundary portion coupled with the main boundary portion and a second exposure portion exposed from the main boundary portion and defining an other side of the cooling fluid passage.

說明書

Accordingly, the main housing H and the second plate P2 including the same kind of resin material with each other may be firmly coupled to each other by using the sealing portion 50 arranged therebetween and including the same kind of resin material therewith. However, the technical scope of embodiments according to the present disclosure is not limited thereto. For example, the main housing H and the second plate P2 may include a flame retarding material, and the sealing portion 50 may not include a flame retarding material. Unlike the main housing H and the second plate P2, the sealing portion 50 may have a relatively small volume, and thus, even when the sealing portion 50 does not include a flame retarding material, problems may not be caused in an emergency situation, such as ignition, explosion, etc. Also, as described below, the sealing portion 50 may be formed in a location directly contacting the outside to require an additional sealing property, and thus, may include a material different from materials of the main housing H or the second plate P2.

The module housing 5 according to some embodiments may be formed via die sliding injection (DSI). For example, the main housing H and the first plate P1 including different kind of materials from each other may be integrally formed with each other via primary molding adopting insert molding, and then, the sealing portion 50 for coupling a primary molding structure, in which the main housing H and the first plate P1 are integrally formed with each other, with the second plate P2 may be formed via secondary molding.

權(quán)利要求

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