Boundary choke between modules in phased array antennas
地域：
WA
WA Seattle
摘要
Technologies directed to a radio frequency (RF) boundary choke between modules in phased array antennas. An antenna module may include a circuit board having one or more conducting layers and one or more electrically insulating layers. The antenna module may include an antenna disposed on a first surface of the circuit board. The antenna module may further include radio frequency front end (RFFE) circuitry disposed on a second surface of the circuit board. The antenna module further includes a first set of vias extending between the antenna and the RFFE circuitry and a second set of vias disposed within the circuit board. Each of the second set of vias is positioned along a first axis parallel to and a first distance from a first edge of the antenna module.
說明書
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A large and growing population of users is enjoying entertainment through the consumption of digital media items, such as music, movies, images, electronic books, and so on. The users employ various electronic devices to consume such media items. Among these electronic devices (referred to herein as endpoint devices, user devices, clients, client devices, or user equipment) are electronic book readers, cellular telephones, Personal Digital Assistants (PDAs), portable media players, tablet computers, netbooks, laptops, and the like. These electronic devices wirelessly communicate with a communications infrastructure to enable the consumption of digital media items. To communicate with other devices wirelessly, these electronic devices include one or more antennas.
The present inventions will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the present invention, which, however, should not be taken to limit the present invention to the specific embodiments, but are for explanation and understanding only.
權(quán)利要求
What is claimed is:1. A communication system comprising:a first circuit board that is electrically grounded; a first antenna module coupled to the first circuit board; a second antenna module coupled to the first circuit board and positioned proximate to the first antenna module, wherein a first edge of the first antenna module and a second edge of the second antenna module are separated by a physical distance that causes standing resonant fields at the first edge and the second edge, the standing resonant fields causing radio frequency (RF) degradation of RF signals communicated by the communication system; wherein the first antenna module comprises:a second circuit board comprising a first set of conducting layers interleaved with a first set of insulating layers; a first set of antennas disposed on a first surface of the second circuit board; radio frequency front-end (RFFE) circuitry disposed on a second surface of the second circuit board; a first set of vias extending between the first surface of the second circuit board and the second surface of the second circuit board, wherein each antenna of the first set of antennas is coupled to a via of the first set of vias, wherein at least some of the first set of vias are located at a first distance from the first edge; and an RF choke located along a first axis parallel to the first edge and at a second distance from the first edge to reduce the standing resonant fields and mitigate the RF degradation caused by the physical distance between the first antenna module and the second antenna module, the second distance being less than the first distance, the RF choke comprising a second set of vias each disposed within a first insulating layer of the first set of insulating layers, wherein each of the second set of vias is positioned along the first axis and the second distance from the first edge, the second distance corresponding to a quarter wavelength of an operating frequency of the first set of antennas. 2. The communication system of claim 1 , wherein the second antenna module comprises:a third circuit board comprising a second set of conducting layers interleaved with a second set of insulating layers; a second set of antennas disposed on a first surface of the third circuit board; second RFFE circuitry disposed on a second surface of the third circuit board; and a third set of vias extending between the first surface of the third circuit board and the second surface of the third circuit board, wherein each antenna of the second set of antennas is coupled to a via of the third set of vias; and a second RF choke located along a second axis parallel to the second edge and at the second distance from the second edge to reduce the standing resonant fields and mitigate the RF degradation caused by the physical distance between the first antenna module and the second antenna module, the RF choke comprising a fourth set of vias each disposed in a second insulating layer of the second set of insulating layers, wherein each of the fourth set of vias is positioned along the second axis and the second distance from the second edge. 3. The communication system of claim 1 , wherein the first antenna module further comprises a third set of vias located along a second axis parallel to the first edge and at a third distance from the first edge to form an RF shield between the first antenna module and the second antenna module, the third distance being less than the first distance and different from the second distance, wherein each of the third set of vias is disposed within a second insulating layer of the first set of insulating layers, wherein each of the third set of vias is positioned along the second axis and the third distance from the first edge. 4. A communication system comprising:a support structure; an antenna module coupled to the support structure, the antenna module comprising:a circuit board having one or more conducting layers and one or more electrically insulating layers; an antenna disposed on a first surface of the circuit board; radio frequency front end (RFFE) circuitry disposed on a second surface of the circuit board; a first set of vias extending between the first surface and the second surface, wherein the antenna is coupled to a via of the first set of vias; a second set of vias disposed within the circuit board, wherein each of the second set of vias is positioned along a first axis parallel to and a first distance from a first edge of the antenna module, and wherein the second set of vias are not directly coupled to the antenna; and a third set of vias disposed within the circuit board, wherein each of the third set of vias is positioned along a second axis parallel to and a second distance, different from the first distance, from the first edge of the antenna module, wherein the third set of vias is configured to shield the first set of vias from radio frequency (RF) interference. 5. The communication system of claim 4 , wherein the first distance corresponds to a quarter wavelength of an operating frequency of the antenna. 6. The communication system of claim 4 , wherein each of the second set of vias is positioned in a first electrically insulating layer and is coupled to a pair of conducting layers adjacent to the first electrically insulating layer. 7. The communication system of claim 6 , wherein the first electrically insulating layer forms a rectangular surface having the first edge, a second edge, a third edge, and a fourth edge, wherein the communication system further comprises a third set of vias disposed within the circuit board, wherein the third set of vias are arranged in a plurality of lines, wherein each of the plurality of lines is parallel to and the first distance from one of the first edge, the second edge, or the third edge. 8. The communication system of claim 4 , wherein the first axis extends between a second edge of the antenna module and a third edge of the antenna module, the third edge being opposite the second edge, wherein the second edge and the third edge are adjacent to the first edge. 9. The communication system of claim 8 , further comprising a third set of vias disposed within the circuit board, wherein each of the third set of vias is positioned along a second axis parallel to and the first distance from the second edge of the antenna module, wherein the second axis extends between the first edge and a fourth edge of the antenna module, the fourth edge being opposite the first edge, wherein the second edge and the third edge are adjacent to the fourth edge. 10. The communication system of claim 4 , wherein the antenna module further comprises a second antenna disposed on the first surface of the circuit board and a third set of vias coupled between the second antenna and the RFFE circuitry. 11. The communication system of claim 4 , wherein the antenna is a patch antenna or part of a phased array antenna. 12. The communication system of claim 4 , further comprising:a second antenna module coupled to the support structure and disposed proximate to the antenna module, wherein the antenna module and the second antenna module are separated by a physical distance, wherein the second set of vias reduce standing resonant fields at the first edge. 13. A space vehicle comprising:a chassis; an antenna module coupled to the chassis, the antenna module comprising:a circuit board comprising one or more conducting layers and one or more electrically insulating layers; an antenna disposed on a first surface of the circuit board; radio frequency front end (RFFE) circuitry disposed on a second surface of the circuit board; a first set of vias extending between the first surface and the second surface, wherein the antenna is coupled to a via of the first set of vias; a second set of vias disposed within the circuit board, wherein each of the second set of vias is positioned along a first axis parallel to and a first distance from a first edge of the antenna module, and wherein the second set of vias are not directly coupled to the antenna; and a third set of vias disposed within the circuit board, wherein each of the third set of vias is positioned along a second axis parallel to and a second distance, different from the first distance, from the first edge of the antenna module, wherein the third set of vias is configured to shield the first set of vias from radio frequency (RF) interference. 14. The space vehicle of claim 13 , wherein the first distance corresponds to a quarter wavelength of an operating frequency of the antenna. 15. The space vehicle of claim 13 , wherein each of the second set of vias is positioned in a first electrically insulating layer and is coupled to a pair of conducting layers adjacent to the first electrically insulating layer. 16. The space vehicle of claim 13 , wherein the first axis extends between a second edge of the antenna module and a third edge of the antenna module, the third edge being opposite the second edge, wherein the second edge and the third edge are adjacent to the first edge. 17. The space vehicle of claim 16 , further comprising a third set of vias disposed within the circuit board, wherein each of the third set of vias is positioned along a second axis parallel to and the first distance from the second edge of the antenna module, wherein the second axis extends between the first edge and a fourth edge of the antenna module, the fourth edge being opposite the first edge, wherein the second edge and the third edge are adjacent to the fourth edge. 18. The space vehicle of claim 13 , wherein the antenna is a patch antenna or part of a phased array antenna.
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