Boundary choke between modules in phased array antennas
摘要
說明書
In some embodiments, multiple layers of circuit board 106 include the vias arranged as vias 172 and vias 142. For example, circuit board 106 may include one or more layers that include vias in a first arrangement (e.g., arranged as vias 172) and a layer having vias in a second arrangement (e.g., arranged as vias 142). In some embodiments, the circuit board 106 may include one or more layers with vias positioned in the first arrangement interleaved with one or more layers with the vias positioned in the second arrangement. Various circuitry, such as circuitry set of vias providing signals to and from antennas 104A, may be disposed within the various layers of the circuit board and may be shielded from RF interference. Further, the various layers may provide a boundary RF choke that mitigates the negative impact of neighboring antenna modules being disposed proximate particular antenna modules and causes degradation through inter-modules gaps formed by the relative positioning of neighboring antenna modules (e.g., standing resonant fields causing radio frequency (RF) degradation to RF signal communicated by antenna module 100).
