FIGS. 3A-B illustrate side views of antenna modules 300A-B according to at least one embodiment. As shown in FIG. 3A, the antenna module 300 includes a circuit board 324 with interleaved conducting layers 302 and electrically insulating layers 304 (e.g., substrate layers, air layers, dielectric layers, etc.). A first side 320A of the antenna module illustrates vias 310 being disposed a common distance from a boundary of the antenna module. The arrangement of the vias may form an RF shield along a boundary perpendicular to the one or more layers (insulating layers 304 and conducting layers 302) of the circuit board 324. On a second side, the vias 310 are disposed a common distance from a boundary of the antenna module 300. However, in one layer, the vias 312 are disposed at a different distance from a boundary of the antenna module 300. For example, in one or more layers of the circuit board 324, one or more arrangements of vias, as described in association with FIGS. 1B-C, may be used.

As shown in FIG. 3A, the antenna module 300 may include one or more antenna elements 340, RFFE circuitry 346, integrated circuitry (not shown), and a set of one or more vias 342 coupled between the antenna element 340 and the RFFE circuitry 346. In some embodiments, the RFFE is coupled to one or more RF circuitry components such as, for example, resistors, capacitors, and RF radios, to receive and transmit RF signals.