Technologies directed to a radio frequency (RF) boundary choke between modules in phased array antennas are provided. One antenna module may include a set of vias each disposed within a circuit board and positioned a distance from (e.g., in a line) an inter-module gap (e.g., a physical distance between antenna modules) between two antenna modules. The set of vias may effectively form an inductor that reduces effects (e.g., performance degradation) that the resonant fields within inter-module modules gaps have on operational components of the antenna module (e.g., antenna elements, radio frequency front-end (RFFE) circuitry, vias coupled between the antenna elements and the RFFE circuitry). Each antenna module of an array of antenna modules may include similar sets of vias on multiple boundaries (e.g., edges such as a first edge, a second edge, etc.) of the corresponding modules to insulate corresponding interior circuitry (e.g., vias coupled to antenna elements and RFFE circuit associated with carrying out operations of the antenna module) from interference occurring from other antenna modules (e.g., neighboring antenna modules), resonant signal propagating within inter-module gabs (e.g., standing resonant fields), and the rest of the environment. For example, a first antenna module may have a first edge that forms a first boundary of an inter-module gap and a second antenna may have a second edge that forms a second boundary of the inter-module gap.