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Boundary choke between modules in phased array antennas

專利號
US11996621B1
公開日期
2024-05-28
申請人
Amazon Technologies, Inc.(US WA Seattle)
發(fā)明人
Peter James Hetzel
IPC分類
H01Q21/06; H01Q1/22; H01Q1/38; H01Q1/42; H04B1/10
技術(shù)領(lǐng)域
antenna,vias,module,satellite,may,system,or,in,satellites,modules
地域: WA WA Seattle

摘要

Technologies directed to a radio frequency (RF) boundary choke between modules in phased array antennas. An antenna module may include a circuit board having one or more conducting layers and one or more electrically insulating layers. The antenna module may include an antenna disposed on a first surface of the circuit board. The antenna module may further include radio frequency front end (RFFE) circuitry disposed on a second surface of the circuit board. The antenna module further includes a first set of vias extending between the antenna and the RFFE circuitry and a second set of vias disposed within the circuit board. Each of the second set of vias is positioned along a first axis parallel to and a first distance from a first edge of the antenna module.

說明書

With regard to FIG. 5, an uplink is a communication link which allows data to be sent to satellite 502 from a ground station 506, UT 508, or a device other than another satellite 502. Uplinks are designated as UL1, UL2, UL3, and so forth. For example, UL1 is a first uplink from the ground station 506 to the second satellite 502(2). In comparison, a downlink is a communication link which allows data to be sent from satellite 502 to a ground station 506, UT 508, or device other than another satellite 502. For example, DL1 is a first downlink from the second satellite 502(2) to the ground station 506. The satellites 502 may also be in communication with one another. For example, a crosslink 590 provides for communication between satellites 502 in the constellation.

權(quán)利要求

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