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Boundary choke between modules in phased array antennas

專利號
US11996621B1
公開日期
2024-05-28
申請人
Amazon Technologies, Inc.(US WA Seattle)
發(fā)明人
Peter James Hetzel
IPC分類
H01Q21/06; H01Q1/22; H01Q1/38; H01Q1/42; H04B1/10
技術領域
antenna,vias,module,satellite,may,system,or,in,satellites,modules
地域: WA WA Seattle

摘要

Technologies directed to a radio frequency (RF) boundary choke between modules in phased array antennas. An antenna module may include a circuit board having one or more conducting layers and one or more electrically insulating layers. The antenna module may include an antenna disposed on a first surface of the circuit board. The antenna module may further include radio frequency front end (RFFE) circuitry disposed on a second surface of the circuit board. The antenna module further includes a first set of vias extending between the antenna and the RFFE circuitry and a second set of vias disposed within the circuit board. Each of the second set of vias is positioned along a first axis parallel to and a first distance from a first edge of the antenna module.

說明書

In at least one embodiment, the RF choke formed by the set of vias 110 operates as an RF open circuit at a distal end of the layer having the set of vias 110 when an effective distance is the specified wavelength (e.g., a quarter-wavelength or a three-quarter wavelength of the operating frequency of antennas 104A-B) and operates as an RF short circuit at a distal end of the layer housing the set of vias 110 for DC signals. In at least one embodiment, the RF choke formed by vias 110 effectively forms an inductor that mitigates performance degradation of the one or more antennas 104A-B caused by resonant fields within one or more inter-module gaps formed by the antenna module 100 and one or more neighboring antenna modules.

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