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Ultra-thin speaker

專利號
US11997449B2
公開日期
2024-05-28
申請人
Goertek Inc.(CN Shandong)
發(fā)明人
Binghua Zheng; Zhiyong Dong
IPC分類
H04R1/28; H04R7/26; H04R9/02; H04R9/06
技術(shù)領(lǐng)域
dust,cone,coil,cap,damper,voice,magnet,speaker,bobbin,ultra
地域: Shandong

摘要

Disclosed is an ultra-thin speaker comprising: a housing; and a magnetic circuit system therein; a vibration system comprising a cone assembly and a voice coil, the cone assembly having a taper≤25°, a peripheral edge thereof connected to the housing, and a middle part thereof having a through hole, the voice coil is fixedly connected at an edge of the through hole, the voice coil surrounds and is suspended around the magnetic circuit system, being able to vibrate by an action of the magnetic field generated by the system when a sound signal is introduced; and a dust cap assembly comprising a dust cap body, a central region of the dust cap body is fixedly connected to the system, and an edge region of the dust cap body is connected to the cone assembly and is able to expand and contract along with the vibration of the cone assembly.

說明書

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Alternatively, the circuit leads 91 are electrically connected to the conductive sheet 34 by welding, and the inner edge of the damper 9 is simultaneously connected to the outer bobbin 31 of the voice coil 3 by welding. Since the coil 33 is electrically connected to the conductive sheet 34, which in turn is electrically connected to the circuit leads 91, and the circuit leads 91 are electrically connected to the external devices, the coil 33 can be electrically connected to the external devices.

In one embodiment, the outer bobbin 31 and/or the inner bobbin 32 are provided thereon with heat dissipation holes, and the arrangement of the heat dissipation holes can effectively increase the heat dissipation capacity of the voice coil 3 during operation. In one embodiment, a bottom wall of the housing 1 is provided with solder pads for soldering with external equipment.

While some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be apparent to those skilled in the art that modifications to the above embodiment can be made without departing from the scope or spirit of the present disclosure. The scope of the present disclosure is limited by the appended claims.

權(quán)利要求

1
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