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Acoustic device

專利號
US11997451B2
公開日期
2024-05-28
申請人
AAC Microtech (Changzhou) Co., Ltd.(CN Changzhou)
發(fā)明人
Shasha Liu; Xiaodong Liu
IPC分類
H04R1/28
技術(shù)領(lǐng)域
acoustic,enclosure,sound,housing,cavity,isolation,component,front,rear,wall
地域: Changzhou

摘要

Provided is an acoustic device, having front and rear surfaces. The acoustic device includes: an enclosure housing being a metal housing; an acoustic component mounted in the enclosure housing, the acoustic component and the enclosure housing cooperate to form front and rear sound cavities, and the front sound cavity is communicated with the sound outlet; an isolation component mounted in the rear sound cavity, the isolation component and the enclosure housing enclose to form a filling cavity configured to be filled with a sound-absorbing material; and at least one buffer attached to an inner surface of the enclosure housing defining the filling cavity, the buffer is configured to reduce noise generated from collision of the sound-absorbing material with the enclosure housing. The acoustic device can reduce collision of the sound-absorbing material with the metallic enclosure housing, thereby reducing noise generated, so as to improve acoustic performance.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13

As shown in FIG. 3 to FIG. 4, the acoustic device 100 further includes a mounting plate 8 arranged on one side of the acoustic component 1 close to the rear surface. The mounting plate 8 abuts against the acoustic component 1 and is fixed to the enclosure housing 2, so as to fix the acoustic component 1 into the enclosure housing 2. The mounting plate 8 is made of stainless steel or carbon steel.

As shown in FIG. 3 to FIG. 5, the acoustic device 100 further includes a stop 9 sandwiched between the acoustic component 1 and the bottom wall 221 of the enclosure housing. The stop 9 is a damper that may be configured to restrict the position of the acoustic component 1 to prevent fall-off. In an embodiment, the stop 9 is partially received in a receiving hole in the middle of the mounting plate 8.

As shown in FIG. 3 to FIG. 7, the acoustic device 100 further includes a buffer 10. The buffer 10 has a mesh structure, which is glued to a cavity wall of the filling cavity, specifically the inner surface of the enclosure housing 2 defining the filling cavity. A plurality of buffers 10 may be provided, which may be attached to any position of the front wall 211, the bottom wall 221, and the side walls 212 and 222 of the enclosure housing.

權(quán)利要求

1
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