FIG. 2 shows a perspective view of an integrated control apparatus 100 according to an embodiment. Like the general control apparatus 10 in FIG. 1, the control apparatus 100 in FIG. 2 likewise comprises an active cooler 102, a power module 106a,b, an intermediate circuit capacitor 104, an interconnect device 108, and a connection 1032, 1034. In concrete terms, the control apparatus comprises a first power module 106a and a second power module 106b, wherein the first power module 106a and the second power module 106b are attached to two opposing sides, specifically on an upper and lower side of the cooler 102 in the perspective view. This means that the cooler 102 is populated on both sides with power semiconductors, thus increasing the power density of the control apparatus 100.

The first power module 106a and the second power module 106b are flat, and extend along a main plane, to which an upward facing main surface of the first power module 106a and a downward facing main surface of the second power module 106b in the perspective view are substantially parallel. The intermediate circuit capacitor 104 comprises two sub-capacitors. An upper sub-capacitor in the perspective view is assigned to the first power module 106a. A lower sub-capacitor in the perspective view is assigned to the second power module 106b. The first section 107 of the interconnect device 108 is located on an end of the power module 106a,b lying opposite the intermediate circuit capacitor 104 (i.e. at the end surface in the perspective view).