The manifold 104 includes an inlet 132 (e.g., input port), a heat sink cavity 108, and a heat sink 110. The inlet 132 is configured to receive coolant from a cooling system (not shown). After entering the inlet 132, the coolant interfaces with the heat sink 110 positioned within the heat sink cavity 108. After interfacing with the heat sink 110, the coolant is configured to receive heat from the heat sink 110. The cold plate assembly 102 further includes an outlet 134 (e.g., output port). The warmed coolant exits the cold plate assembly 102 via the outlet 134. In this way, the cold plate assembly 102 is able to cool the power electronics assembly 100. In embodiments, the inlet 132 and the outlet 134 are positioned on opposing sidewalls of the manifold 104. In embodiments, the inlet 132 and the outlet 134 are positioned on the same sidewalls or adjacent sidewalls of the manifold 104. In embodiments, either the inlet 132 and/or the outlet 134 may be positioned on the first surface 106 or the second surface 107 of the manifold 104.