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Power device assemblies and methods of fabricating the same

專利號
US11997838B2
公開日期
2024-05-28
申請人
Toyota Motor Engineering & Manufacturing North America Inc.(US TX Plano)
發(fā)明人
Feng Zhou; Yanghe Liu; Hiroshi Ukegawa
IPC分類
H05K7/20; H01L23/367
技術領域
power,assembly,graphite,sink,device,manifold,heat,coolant,cavity,assemblies
地域: TX TX Plano

摘要

Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.

說明書

In embodiments, the base composition of the graphite or graphite-composite may be re-oriented such that the graphite or graphite-composite has an increased thermal conductivity in the Z-axis (as depicted in FIG. 4). This is advantageous as the direction of the heat transfer may be controlled to increase a rate of cooling of each power device assembly 114. In embodiments, the graphite or graphite-composite may also be re-oriented such that the graphite or graphite-composite has an increased thermal conductivity in the Z-axis and a second axis (e.g., X-axis, or Y-axis as depicted in FIG. 4). In embodiments, the graphite or graphite-composite may be re-oriented such that the graphite or graphite-composite has an increased thermal conductivity in the X-axis and/or the Y-axis. The graphite or graphite-composite may be re-oriented through any known means (e.g., carbonization process, magnetism process).

Conventional systems may have misalignment due to high assembly tolerances. The high assembly tolerances may be a result of a fabrication inaccuracy of the individual components of these conventional systems. Accordingly, these conventional systems may be prone to PCB vias being misaligned to the electrical pads of the power electronic devices, which may prevent PCBs to be 3D printed upon these conventional systems.

權利要求

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