Referring now to FIG. 3, the power device assembly 114 is shown in an exploded view, according to various embodiments. The plurality of power device assemblies 114 are embedded (e.g. disposed) onto the plurality of substrate cavities 112. As a non-limiting example, the plurality of power device assemblies 114 may define an inverter circuit for powering an electric device, such as an electric motor. Each of the power device assemblies 114 include a Direct Bonded Metal (DBM) substrate 119 (shown in FIG. 6). The DBM substrate 119 includes a ceramic layer (e.g., alumina) sandwiched (e.g., interposed) between two metal layers (e.g., Cu or Al). The DBM substrate 119 provides electrical insulation for the power device assemblies 114 from each other. Each DBM substrate 119 is bonded to the power device cavity 122 via a first bonding layer (e.g., adhesive layer). The first bonding layer is positioned on a bottom surface and/or side surfaces of the power device cavity 122 and is configured to bond components to the power device cavity 122. The first bonding layer may composed of silver sintering, soldering, Transient Liquid Phase bonding (TLP) or any other suitable bonding material. The S-cell 116 may then be bonded to the DBM substrate 119 via a second bonding layer interposed between the S-cell 116 and the DBM substrate 119.