In one embodiment, the heat dissipation system 110 is a thermosiphon system. In the illustrated embodiment, the heat dissipation system 110 includes a first cooling loop 111, a second cooling loop 121, a third cooling loop 131, and a condenser 114. The condenser 114 is disposed outside the sealed casing 109. The first cooling loop 111 includes a first two-phase heat transfer device 122. In one embodiment, the first two-phase heat transfer device 122 is an evaporator disposed within the sealed casing 109. Further, the first two-phase heat transfer device 122 is configured to function as a first passive pump. It should be noted herein that the term “first passive pump” refers to the first two-phase heat transfer device 122, which is configured for indirectly pumping a two-phase fluid to the condenser 114. The first cooling loop 111 includes a first conduit 111a extending from a downstream end 150 of the condenser 114 to an upstream end 152 of the first two-phase heat transfer device 122 through the sealed casing 109. Similarly, the first cooling loop 111 further includes a second conduit 111b extending from a downstream end 154 of the first two-phase heat transfer device 122 to an upstream end 156 of the condenser 114 through the sealed casing 109.