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Heat dissipation system and an associated method thereof

專利號(hào)
US11997839B2
公開日期
2024-05-28
申請(qǐng)人
General Electric Company(US GA Atlanta)
發(fā)明人
Alistair Martin Waddell; Mark Aaron Chan Chan; Owen Jannis Schelenz; Michael Fernahl
IPC分類
H05K7/20; F28D15/02; H01L23/427
技術(shù)領(lǐng)域
phase,heat,fluid,condenser,transfer,conduit,cooling,two,first,device
地域: NY NY Schenectady

摘要

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

說明書

FIG. 3 illustrates a perspective view of a two-phase heat transfer device 172 in accordance with one embodiment of the disclosed technique. The two-phase heat transfer device 172 is substantially similar to the first, second, and third two-phase heat transfer devices 122, 132, 142 as discussed in the embodiment of FIG. 2. The two-phase heat transfer device 172 includes a supply housing 180, a receiving housing 182, and an expansion housing 184 extending between the supply housing 180 and the receiving housing 182. The expansion housing 184 includes a flow inlet 186 coupled to the supply housing 180 and a flow outlet 188 coupled to the receiving housing 182. The supply housing 180 includes a first flow opening 190 defined therein and the receiving housing 182 includes a second flow opening 192 defined therein. In another embodiment, a plurality of two-phase heat transfer devices 172 may be coupled together to increase the cooling capacity of the heat dissipation system 110. Alternatively, as will be described in more detail below, the plurality of two-phase heat transfer devices 172 may be formed integrally as a unitary structure. In the illustrated embodiment, at least a portion of each of the supply housing 180 and the receiving housing 182 may be oriented perpendicular relative to the expansion housing 184. The plurality of two-phase heat transfer devices 172 may be spaced apart vertically.

權(quán)利要求

1
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