FIG. 5 illustrates a schematic diagram of a heat dissipation system 310 in accordance with one embodiment of the present invention. In the illustrated embodiment, the heat dissipation system 310 includes a first cooling loop 311, a second cooling loop 321, and a third cooling loop 331. For ease of illustration, the condenser is not shown in the embodiment of FIG. 5. The first cooling loop 311 includes a first two-phase heat transfer device 312, the second cooling loop 321 includes a second two-phase heat transfer device 322, and the third cooling loop 331 includes a third two-phase heat transfer device 332. The first two-phase heat transfer device 312 receives a first portion 320a of a single-phase fluid 320 from the condenser and produce a first portion 324a of a two-phase fluid 324. Similarly, the second two-phase heat transfer device 322 receives a second portion 320b of the single-phase fluid 320 from the condenser and produce a second portion 324b of the two-phase fluid 324. The third two-phase heat transfer device 332 is receives a third portion 320c of the single-phase fluid 320 from the condenser and produce a third portion 324c of the two-phase fluid 324. It should be noted herein that the first portion 324a, the second portion 324b, and the third portion 324c of the two-phase fluid 324 are produced by exchanging heat with respective electronic components and/or the fluid within a sealed casing. In certain embodiments, the heat dissipation system 310 is configured to perform at least one of regulating a flow rate of the single-phase fluid 320 and the two-phase fluid 324 in the first, second, and third cooling loops 311, 321, 331 by passively pumping the first, second, and third portions 324a, 324b, 324c of the two-phase fluid 324 by each of the two-phase heat transfer device 312, 322, 332. Specifically, the first portion 320a of the single-phase fluid 320 and the first portion 324a of a two-phase fluid 324 in the first cooling loop 311 is passively pumped by first two-phase heat transfer device 312 to regulate the flow rate of the single-phase fluid 320 and the two-phase fluid 324. Similarly, the second portion 320b of the single-phase fluid 320 and the second portion 324b of the two-phase fluid 324 in the second cooling loop 321 is passively pumped by the second two-phase heat transfer device 322 to regulate the flow rate of the single-phase fluid 320 and the two-phase fluid 324 in the second cooling loop 321. Further, the third portion 320c of the single-phase fluid 320 and the third portion 324c of the two-phase fluid 324 in the third cooling loop 331 is passively pumped by the third two-phase heat transfer device 332 to regulate the flow rate of the single-phase fluid 330 and the two-phase fluid 334 in the third cooling loop 331. In accordance with the embodiments of the present invention, there is no need for use of active pumps for pumping the two-phase fluid from two-phase heat transfer devices 312, 322, 332.