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Heat dissipation system and an associated method thereof

專利號
US11997839B2
公開日期
2024-05-28
申請人
General Electric Company(US GA Atlanta)
發(fā)明人
Alistair Martin Waddell; Mark Aaron Chan Chan; Owen Jannis Schelenz; Michael Fernahl
IPC分類
H05K7/20; F28D15/02; H01L23/427
技術(shù)領(lǐng)域
phase,heat,fluid,condenser,transfer,conduit,cooling,two,first,device
地域: NY NY Schenectady

摘要

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

說明書

FIG. 6 illustrates a flow diagram of a method 400 of a thermal management of a power converter in accordance with one embodiment. In one embodiment, the method 400 involves directing a first portion of a single-phase fluid from a condenser to a first two-phase heat transfer device of a first cooling loop at step 402. In certain embodiments, the single-phase fluid includes a liquid medium. In one embodiment, the power converter includes a sealed casing and the condenser is disposed outside the sealed casing. The method 400 further involves directing a second portion of the single-phase fluid from the condenser to a second two-phase heat transfer device of a second cooling loop at step 404. Further, the method 400 involves dissipating heat from a first component to the first portion of the single-phase fluid via the first two-phase heat transfer device and produce a first portion of a two-phase fluid at step 406. The first component is disposed within the sealed casing and coupled to the first two-phase heat transfer device. In certain embodiments, the two-phase fluid includes a liquid medium and a gaseous medium. The method 400 further involves a step 408 of dissipating heat from a second component to the second portion of the single-phase fluid via the second two-phase heat transfer device and produce a second portion of the two-phase fluid. In one example embodiment, the second component is disposed within the sealed casing and coupled to the second two-phase heat transfer device. The method 400 further involves pumping the first portion of the two-phase fluid from the first two-phase heat transfer device to the condenser at step 410. In one embodiment, the first two-phase heat transfer device is configured to passively pump the first portion of the two-phase fluid to the condenser. The method 400 further involves pumping the second portion of the two-phase fluid from the second two-phase heat transfer device to the condenser at step 412. In one embodiment, the second two-phase heat transfer device is configured to passively pump the second portion of the two-phase fluid to the condenser. In some embodiments, the first and second cooling loops are disposed parallel to one another. In some embodiments, the method 400 further involves a step of dissipating heat from a third component to the second portion of the single-phase fluid via a single-phase heat transfer device of the second cooling loop before directing the second portion of the single-phase fluid to the second two-phase heat transfer device. In one embodiment, the third component and the single-phase heat transfer device are disposed within the sealed casing. Further, the single-phase heat transfer device is coupled to the third component.

權(quán)利要求

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