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1TnC memory bit-cell having stacked and folded planar capacitors with lateral offset

專利號(hào)
US11997853B1
公開日期
2024-05-28
申請(qǐng)人
Kepler Computing Inc.(US CA San Francisco)
發(fā)明人
Rajeev Kumar Dokania; Amrita Mathuriya; Debo Olaosebikan; Tanay Gosavi; Noriyuki Sato; Sasikanth Manipatruni
IPC分類
H10B53/30
技術(shù)領(lǐng)域
capacitors,capacitor,bit,in,electrode,node,layer,some,memory,wherein
地域: CA CA San Francisco

摘要

A configuration for efficiently placing a group of capacitors with one terminal connected to a common node is described. The capacitors are stacked and folded along the common node. In a stack and fold configuration, devices are stacked vertically (directly or with a horizontal offset) with one terminal of the devices being shared to a common node, and further the capacitors are placed along both sides of the common node. The common node is a point of fold. In one example, the devices are capacitors. N number of capacitors can be divided in L number of stack layers such that there are N/L capacitors in each stacked layer. The N/L capacitors are shorted together with an electrode (e.g., bottom electrode). The electrode can be metal, a conducting oxide, or a combination of a conducting oxide and a barrier material. The capacitors can be planar, non-planar or replaced by memory elements.

說明書

FIG. 18F illustrates 3-input configurable threshold gate 1860 with the pull-down device and having linear or paraelectric capacitors that are arranged as stacked and folded non-planar capacitors, and with an aligned central pedestal and an extended metal layer, in accordance with some embodiments. In this example three capacitors are stacked and folded. In some embodiments, at least two columns of shared metal are connected to summing node n1 1863. For further folding of capacitors, additional columns of shared metal can be connected to summing node n1 1863. In one such embodiment, via1 for n1 is made wider to accommodate connection with additional columns. In some embodiments, all three capacitors are directly coupled to summing node n1 1863 and there are no capacitors vertically over the capacitors. In some embodiments, at least two capacitors are on a vertical stack and one capacitor is on a separate stack directly coupled to summing node n1 1863.

In some embodiments, summing node n1 1863 is coupled to a metal stub on M1 which in turn is coupled to a source contact of transistor MN1. The drain contact of transistor MN1 is connected to Vss (ground). The gate terminal of the transistor is connected to control node “down”. The columns of vertical metal form the bottom electrodes of the capacitors or are directly adjacent to the bottom electrodes of the capacitors.

權(quán)利要求

1
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