In one embodiment, the second node and the third node are connected via an X2-C interface.
In one embodiment, a link between the second node and the third node is a non-ideal backhaul.
In one embodiment, a link between the second-type node and the third node is an ideal backhaul.
In one embodiment, the first node and the third node are connected via a Uu interface.
In one embodiment, the first node and the second node are connected via a Uu interface.
In one embodiment, the first node is a device supporting dual connectivity.
In one embodiment, the first node supports Multi-Radio Dual Connectivity (MR-DC).
In one embodiment, the first node supports NR-NR Dual Connectivity (NR DC).
In one embodiment, the first node supports Intra-E-UTRA DC.
In one embodiment, the first node supports NR-E-UTRA Dual Connectivity (NE-DC).
In one embodiment, the first node supports NG-RAN E-UTRA-NR Dual Connectivity (NGEN-DC).
In one embodiment, the first node supports E-UTRA-NR Dual Connectivity (EN DC).
In one embodiment, a signaling bearer between the first node and the second node comprises an SRB1.
In one embodiment, a signaling bearer between the first node and the second node comprises an SRB2.
In one embodiment, a signaling bearer between the first node and the second node comprises an SRB3.
In one embodiment, a signaling bearer between the first node and the third node comprises an SRB1.
In one embodiment, a signaling bearer between the first node and the third node comprises an SRB2.