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Control method of inspection apparatus and inspection apparatus

專利號(hào)
US12075537B2
公開日期
2024-08-27
申請(qǐng)人
Tokyo Electron Limited(JP Tokyo)
發(fā)明人
Hiroaki Agawa
IPC分類
G01R31/28; H05B45/12; H05B45/40
技術(shù)領(lǐng)域
led,arrays,correction,correctors,wafer,c12,inspection,twelve,thermal,401a
地域: Tokyo

摘要

A control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

說明書

CROSS-REFERENCE TO RELATED APPLICATION

The present application is based upon and claims priority to Japanese Patent Application No. 2020-161313, filed on Sep. 25, 2020, the entire contents of which are incorporated herein by reference.

BACKGROUND 1. Field

The present disclosure relates to a control method of an inspection apparatus and an inspection apparatus.

2. Background Art

Patent Document 1 discloses a prober that sequentially inspects, by a tester, electrical characteristics of a plurality of chips to be inspected provided in matrix. The prober includes a plurality of LED units and a controller configured to output a control signal to drive the LED units. The plurality of LED units are provided on a side opposite to a placing surface of a stage so as to independently heat a plurality of areas where the plurality of chips are located, respectively. The controller outputs a control signal to drive, among the plurality of LED units, at least an LED unit corresponding to an area of a chip to be inspected, among the area of the chip to be inspected and peripheral areas of the corresponding area.

PRIOR ART DOCUMENT Patent Document

  • [Patent Document 1] Japanese Laid-open Patent Publication No. 2019-102645

The present disclosure provides a technique that enables to correct a control command so as to evenly heat an inspection object to be inspected.

SUMMARY OF THE INVENTION

權(quán)利要求

1
What is claimed is:1. A control method of an inspection apparatus includinga stage on which a substrate having an inspection object to be inspected is mounted anda plurality of light sources configured to emit light to heat the substrate,wherein the control method comprises:individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate;obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions;obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; andcorrecting the amount of light output from each of the at least one or more light sources using the one or more correction values,wherein the obtaining of the plurality of first temperature distributions includes obtaining first thermal images by imaging the substrate with a thermal image obtaining section, andwherein the sum of the plurality of first temperature distributions is calculated based on the first thermal images.2. The control method of the inspection apparatus according to claim 1,wherein the plurality of light sources are arranged at a plurality of respective areas that are sectioned in plan view,wherein the plurality of areas include one or more first areas where the inspection object to be inspected is located, a plurality of second areas surrounding the one or more first areas, and an area other than the one or more first areas and the second areas, andwherein, when obtaining the first temperature distributions, only a plurality of light sources, corresponding to the one or more first areas and the plurality of second areas, of the plurality of light sources are individually lighted.3. The control method of the inspection apparatus according to claim 2, wherein a correction value for a plurality of light sources corresponding to the plurality of second areas of the plurality of light sources is greater than a correction value for one or more light sources corresponding to the one or more first areas of the plurality of light sources.4. The control method of the inspection apparatus according to claim 1,wherein the obtaining of the one or more correction values includes obtaining a plurality of correction values for correcting the amount of light output from the plurality of light sources based on the second temperature distribution, andwherein the correcting of the amount of light using the one or more correction values includes correcting the amount of light output from each of the plurality of respective light sources using the plurality of respective correction values.5. The control method of the inspection apparatus according to claim 1, wherein the obtaining of the second temperature distribution includes obtaining, as the second temperature distribution, a temperature distribution represented by a second thermal image having a sum of temperatures for each pixel of the plurality of first thermal images.6. The control method of the inspection apparatus according to claim 5,wherein the second thermal image is a thermal image having, for pixels in a presence area of the first thermal images, a sum of temperatures for each pixel of the first thermal images, andwherein the presence area is an area where one or more light sources of the plurality of light sources are located where the inspection object to be inspected is present in plan view.7. The control method of the inspection apparatus according to claim 5, wherein the obtaining of the one or more correction values includes obtaining, by optimization calculation, a combination of the one or more correction values that minimize a sum of squares of a difference between the sum of the temperatures in each pixel of the second thermal image and a predetermined temperature.8. The control method of the inspection apparatus according to claim 7, wherein the predetermined temperature is a setting temperature used when inspecting the inspection object to be inspected.9. An inspection apparatus comprising:a stage on which a substrate having an inspection object to be inspected is mounted;a plurality of light sources configured to emit light to heat the substrate;a controller configured to control the plurality of light sources; andone or more correctors configured to correct one or more respective control commands output from the controller to at least one or more respective light sources of the plurality of light sources,wherein the controller performsindividually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate;obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions;obtaining one or more correction values for correcting, by the one or more correctors, an amount of light output from the at least one or more light sources based on the second temperature distribution; andcorrecting the amount of light output from each of the at least one or more respective light sources by the one or more respective correctors using the one or more correction values,wherein the obtaining of the plurality of first temperature distributions includes obtaining first thermal images by imaging the substrate with a thermal image obtaining section, andwherein the sum of the plurality of first temperature distributions is calculated based on the first thermal images.
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